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Specifications A-1
Appendix A
Subsystem Specifications
A.1. Technical Specifications
Environmental Specifications
Humidity
5% to 95% (non condensing – operating and non-
operating)
Temperature
Operating: 0º to 40ºC
(0º to 35ºC when BBU is applied)
Non-operating: -20º to 60ºC
Altitude
Operating: sea level to 12,000 ft
Non-operating: sea level to 20,000 ft
Power Requirements
Input Voltage
100VAC @ 16A
240VAC @ 8A with PFC
(auto-switching)
Frequency
50 to 60Hz
Power
Consumption
405W
Dimensions
With Forearm Handles Without Forearm
Handles
Height
174.4mm (6.86 inches) 174.4mm (6.86 inches)
Width
482mm (19 inches) 445mm (17.5 inches)
Length
514mm (20.2 inches) 498mm (19.6 inches)
- Galaxy RAID 1
- Installation and Hardware 1
- Reference Manual 1
- Contact Information 2
- Copyright 2007 3
- Warnings and Certifications 4
- Table of Contents 7
- Safety Precautions 11
- About This Manual 12
- Revision History 12
- Who should read this manual? 12
- Related Documentation 12
- Conventions 13
- CAUTION! 13
- IMPORTANT! 13
- Chapter 1 16
- Introduction 16
- 1.1.1 Enclosure Chassis 17
- 1.1.1.1 Chassis Overview 17
- 1.1.1.2 Physical Dimensions 18
- 1.1.1.4 Drive Slot Numbering 19
- 1.1.1.5 Rear Panel Overview 20
- 1.2. Subsystem Components 21
- 1.2.2 Drive Trays 22
- 1.2.3 RAID Controller Module 22
- 1.2.5 DIMM Module 24
- 1.2.6 BBU Module 24
- 1.2.7 Power Supply Units 25
- Figure 1-11: PSU Module 26
- 1.2.8 Cooling Modules 27
- 1.2.9 Enclosure DIP Switches 28
- 1.3. Subsystem Monitoring 29
- 1.4.3 Normalized Airflow 31
- Chapter 2 33
- Hardware Installation 33
- Back-end PCBs 37
- 2.7.2 Installation Steps 44
- 2.10.1 Component Description 53
- Chapter 3 57
- Subsystem Monitoring 57
- 3.2. Status-indicating LEDs 58
- 3.2.1.1 Fibre Port LEDs 59
- 3.2.1.2 Restore Default LED 59
- 3.2.2 LAN Port LEDs 60
- 3.2.3 LCD Keypad Panel 60
- System Monitoring 61
- 3.2.4 Drive Tray LEDs 62
- 3.2.5 BBU Module LED 63
- 3.2.6 PSU Module LED 64
- 3.2.7 Cooling Module LED 65
- 3.3. Audible Alarm 66
- C Monitoring 67
- Chapter 4 68
- Connection and Operation 68
- 4.1.2 FC Lasers 69
- 4.1.4 SFP Transceivers 69
- Considerations 70
- 4.2.3 Host-side Topologies 72
- 4.2.4 Drive-side Topologies 72
- 4.2.5 Internal Connections 72
- 4.2.6 Unique Identifier 73
- 4.2.7 ID/LUN Mapping 73
- 4.3 Fibre Channels 74
- IMPORTANT: 76
- Channel Settings 81
- Tolerance 82
- Configuration Information 83
- 4.4.4 Expansion Links 88
- 4.5 Power On 89
- 4.5.2 Power On Procedure 90
- 4.5.3 Power On Status Check 91
- 4.5.4 LCD Screen 93
- GHDX2-24 93
- 4.6 Power Off Procedure 94
- Chapter 5 96
- Subsystem Maintenance 96
- 5-2 Subsystem Maintenance 97
- 5-1: Removing the BBU Module 100
- 5-5: Removing the BBU Module 104
- 5-6: Removing the Power Cord 106
- 5-8: Dislodging the PSU 107
- WARNING! 109
- 5.6. Drive Tray Maintenance 110
- Appendix A 113
- Subsystem Specifications 113
- A.6. RAID Management 117
- Specifications A-7 119
- Appendix B 120
- Spare Parts and Accessories 120
- Appendix C 123
- Pinouts 123
- C.2. COM1 Serial Port Cable 125
- Appendix C Pinouts 127
- Pinouts C-5 127
- C.5. Null Modem 128
- C.6. Ethernet Port Pinouts 129
- C.7. Power Socket 129
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